阻焊层(Solder Mask): 包括顶层阻焊层(Top solder) 和底层阻焊层(Bottom solder) ,其作用与锡膏层相反,指的是要盖绿油的层。
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设置... 回复: 如果你设计的PCB某些部分不需要阻焊,要镀锡增大电流用,则在该位置的阻焊层(TOP SOLDER或者BOTTOM SOLDER)划上线(LINE)或填充(FILL)即可. 回复: 放烤箱里烤!
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...heather color » 石南颜色 top solder » 顶尖的焊锡 I know there must be someone waiting for me somewhere in the world,so I take care of myself everyday » 我知道要有人在等待...
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... Bottom Paste:底层锡膏层。同上 Top Solder:顶层焊锡层。或者称为阻焊层,因为是负片的形式 Bottom Solder:底层焊锡层。同上 ...
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Top Solder Mask 焊层 ; 顶层阻焊层 ; 顶层阻焊层颜色 ; 有顶部阻焊层
Top Solder Mak 分为顶层阻焊层
GTS Top Solder 顶层阻焊
Solder Mask Top 顶层掩膜层 ; 顶层阻焊
solder-top can 顶焊罐
The top and bottom of the solder pot and drawing out adopt the warm mechanism method, and aim at the improvement of maintenance.
焊锅底部和顶部以及回火采用暖温机械方法,目的是改善维修。
In the forming process of the solder embossment, a top (27) of a plurality of solder embossments (22) is flatted and roughened.
在焊料突起成形工序中,对多个焊料突起(22)的顶部(27)进行平坦化及粗糙化。
In the supply process of solder, a welding fluid (28) is supplied to the top (27) of a plurality of solder embossments (22) which is flatted and roughened.
在焊剂供给工序中, 向已被平坦化及粗糙化的多个焊料突起(22)的顶部(27)供给焊剂 (28)。
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